ISO 9455-1:1990
Withdrawn
Withdrawn
View Superseded by
Soft soldering fluxes — Test methods — Part 1: Determination of non-volatile matter, gravimetric method
Available format(s)
Hardcopy , PDF
Language(s)
English, French
Published date
11-15-1990
Withdrawn date
04-09-2025
Superseded by
US$96.00
Excluding Tax where applicable
Specifies a gravimetric method for the determination of the content of non-volatile matter in soft soldering fluxes. Applies to liquid and paste fluxes of type 1, as defined in ISO 9454-1.
| Committee |
ISO/TC 44/SC 12
|
| DevelopmentNote |
Also numbered as BS EN 29455-1 (10/2005)
|
| DocumentType |
Standard
|
| Pages |
2
|
| PublisherName |
International Organization for Standardization
|
| Status |
Withdrawn
|
| SupersededBy |
| Standards | Relationship |
| ONORM EN 29455-1 : 1994 | Identical |
| DS EN 29455-1 : 1997 | Identical |
| NF EN 2199455-1 : 1994 | Identical |
| NBN EN 29455-1 : 1994 | Identical |
| NBN EN 29455-5 : 1993 | Identical |
| NEN ISO 9455-1 : 1994 | Identical |
| NS ISO 9455-1 : 1ED 1994 | Identical |
| I.S. EN 29455-1:1994 | Identical |
| PN EN 29455-1 : 2001 | Identical |
| EN 29455-1:1993 | Identical |
| EN 29455-11:1993 | Identical |
| DIN EN 29455-1:1994-02 | Identical |
| UNE-EN 29455-1:1995 | Identical |
| DIN EN 29455-1:1994-02 | Corresponds |
| BS IEC 61189-5-4 : 2015 | TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-4: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID WIRE FOR PRINTED BOARD ASSEMBLIES |
| BS EN ISO 9454-1:2016 | Soft soldering fluxes. Classification and requirements Classification, labelling and packaging |
| 12/30270787 DC : 0 | BS EN ISO 9455-5 - SOFT SOLDERING FLUXES - TEST METHODS - PART 5: COPPER MIRROR TEST |
| 12/30274796 DC : 0 | BS IEC 61189-5-2 ED.1 - TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-2: TEST METHODS FOR PRINTED BOARD ASSEMBLIES: SOLDERING FLUX |
| CEI EN 61189-5-2 : 2016 | TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-2: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING FLUX FOR PRINTED BOARD ASSEMBLIES |
| I.S. EN ISO 9455-14:2017 | SOFT SOLDERING FLUXES - TEST METHODS - PART 14: ASSESSMENT OF TACKINESS OF FLUX RESIDUES (ISO 9455-14:2017) |
| IEC 61189-5-2:2015 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies |
| BS EN 61189-5-1:2016 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Guidance for printed board assemblies |
| BS EN ISO 9454-2:2001 | Soft soldering fluxes. Classification and requirements Performance requirements |
| EN 61189-5-1:2016 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies |
| EN 61189-5-4:2015 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies |
| EN 61189-5-3:2015 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies |
| I.S. EN ISO 9455-6:1997 | SOFT SOLDERING FLUXES - TEST METHODS - PART 6: DETERMINATION AND DETECTION OF HALIDE (EXCLUDING FLUORIDE) CONTENT |
| BS EN 61189-5-3:2015 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Soldering paste for printed board assemblies |
| BS EN ISO 9455-15:2017 | Soft soldering fluxes. Test methods Copper corrosion test |
| 12/30274800 DC : 0 | BS IEC 61189-5-3 ED.1 - TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-3: TEST METHODS FOR PRINTED BOARD ASSEMBLIES: SOLDERING PASTE |
| NF EN 61189-5 : 2008 | TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5: TEST METHODS FOR PRINTED BOARD ASSEMBLIES |
| DIN EN ISO 9455-3:1994-11 | SOFT SOLDERING FLUXES - TEST METHODS - PART 3: DETERMINATION OF ACID VALUE, POTENTIOMETRIC AND VISUAL TITRATION METHODS |
| IEC 61189-5-4:2015 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies |
| BS EN ISO 9455-6:1997 | Soft soldering fluxes. Test methods Determination and detection of halide (excluding fluoride) content |
| I.S. EN ISO 9454-2:2000 | SOFT SOLDERING FLUXES - CLASSIFICATION AND REQUIREMENTS - PART 2: PERFORMANCE REQUIREMENTS |
| 14/30309692 DC : 0 | BS EN 61189-5-1 ED 1.0 - TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-1: TEST METHODS FOR PRINTED BOARD ASSEMBLIES AND MATERIALS USED IN MANUFACTURING ELECTRONIC ASSEMBLIES - GUIDANCE DOCUMENTS AND HANDBOOKS |
| BS EN 61189-5-4:2015 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies |
| 16/30337155 DC : 0 | BS EN ISO 9455-14 - SOFT SOLDERING FLUXES - TEST METHODS - PART 14: ASSESSMENT OF TACKINESS OF FLUX RESIDUES |
| BS IEC 61189-5-3 : 2015 | TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-3: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING PASTE FOR PRINTED BOARD ASSEMBLIES |
| 14/30285529 DC : 0 | BS EN ISO 9454-1 - SOFT SOLDERING FLUXES - CLASSIFICATION AND REQUIREMENTS - PART 1: CLASSIFICATION, LABELLING AND PACKAGING |
| BS EN ISO 9455-5:2014 | Soft soldering fluxes. Test methods Copper mirror test |
| DIN EN ISO 9454-1:2016-07 | SOFT SOLDERING FLUXES - CLASSIFICATION AND REQUIREMENTS - PART 1: CLASSIFICATION, LABELLING AND PACKAGING (ISO 9454-1:2016) |
| I.S. EN 61189-5:2006 | TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5: TEST METHODS FOR PRINTED BOARD ASSEMBLIES |
| I.S. EN ISO 9454-1:2016 | SOFT SOLDERING FLUXES - CLASSIFICATION AND REQUIREMENTS - PART 1: CLASSIFICATION, LABELLING AND PACKAGING (ISO 9454-1:2016) |
| EN ISO 9455-14:2017 | Soft soldering fluxes - Test methods - Part 14: Assessment of tackiness of flux residues (ISO 9455-14:2017) |
| IEC 61189-5:2006 | Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies |
| EN ISO 9454-2:2000 | Soft soldering fluxes - Classification and requirements - Part 2: Performance requirements (ISO 9454-2:1998) |
| EN ISO 9455-5:2014 | Soft soldering fluxes - Test methods - Part 5: Copper mirror test (ISO 9455-5:2014) |
| 12/30274804 DC : 0 | BS IEC 61189-5-4 ED.1 - TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-4: TEST METHODS FOR PRINTED BOARD ASSEMBLIES: SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID WIRE |
| BS EN 61189-5:2006 | Test methods for electrical materials, interconnection structures and assemblies Test methods for printed board assemblies |
| BS EN 61189-5-2:2015 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Soldering flux for printed board assemblies |
| BS EN ISO 9455-14:2017 | Soft soldering fluxes. Test methods Assessment of tackiness of flux residues |
| I.S. EN ISO 9455-5:2014 | SOFT SOLDERING FLUXES - TEST METHODS - PART 5: COPPER MIRROR TEST (ISO 9455-5:2014) |
| I.S. EN ISO 9455-15:2017 | SOFT SOLDERING FLUXES - TEST METHODS - PART 15: COPPER CORROSION TEST (ISO 9455-15:2017) |
| I.S. EN 61189-5-4:2015 | TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-4: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID WIRE FOR PRINTED BOARD ASSEMBLIES |
| ISO 9455-14:2017 | Soft soldering fluxes — Test methods — Part 14: Assessment of tackiness of flux residues |
| DIN EN ISO 9455-9:1995-11 | Soft soldering fluxes - Test methods - Part 9: Determination of ammonia content (ISO 9455-9:1993); German version EN ISO 9455-9:1995 |
| DIN EN ISO 9455-2:1995-11 | SOFT SOLDERING FLUXES - TEST METHODS - PART 2: DETERMINATION OF NON-VOLATILE MATTER, EBULLIOMETRIC METHOD |
| DIN EN ISO 9455-6:1997-03 | Soft soldering fluxes - Test methods - Part 6: Determination and detection of halide (excluding fluoride) content (ISO 9455-6:1995); German version EN ISO 9455-6:1997 |
| ISO 9455-3:1992 | Soft soldering fluxes — Test methods — Part 3: Determination of acid value, potentiometric and visual titration methods |
| IEC 61189-5-1:2016 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies |
| IEC 61189-5-3:2015 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies |
| ISO 9454-2:1998 | Soft soldering fluxes — Classification and requirements — Part 2: Performance requirements |
| ISO 9455-5:2014 | Soft soldering fluxes — Test methods — Part 5: Copper mirror test |
| ISO 9455-6:1995 | Soft soldering fluxes — Test methods — Part 6: Determination and detection of halide (excluding fluoride) content |
| BS EN 29455-5:1993 | Soft soldering fluxes. Test methods Copper mirror test |
| EN 29455-5:1993 | Soft soldering fluxes - Test methods - Part 5: Copper mirror test (ISO 9455-5:1992) |
| EN ISO 9455-6:1997 | Soft soldering fluxes - Test methods - Part 6: Determination and detection of halide (excluding fluoride) content (ISO 9455-6:1995) |
| EN ISO 9454-1:2016 | Soft soldering fluxes - Classification and requirements - Part 1: Classification, labelling and packaging (ISO 9454-1:2016) |
| IEEE DRAFT 1003.1Q : D8 2000 | DRAFT STANDARD FOR INFORMATION TECHNOLOGY-PORTABLE OPERATING SYSTEMS INTERFACE (POSIX) - PART 1: SYSTEM APPLICATION PROGRAM INTERFACE (API) - AMENDMENT X: TRACING (C LANGUAGE) |
| 16/30337159 DC : 0 | BS EN ISO 9455-15 - SOFT SOLDERING FLUXES - TEST METHODS - PART 15: COPPER CORROSION TEST |
| BS IEC 61189-5-2 : 2015 | TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-2: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING FLUX FOR PRINTED BOARD ASSEMBLIES |
| DIN EN ISO 9455-5:2014-10 | Soft soldering fluxes - Test methods - Part 5: Copper mirror test (ISO 9455-5:2014) |
| I.S. EN 61189-5-3:2015 | TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-3: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING PASTE FOR PRINTED BOARD ASSEMBLIES |
| I.S. EN 61189-5-2:2015 | TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-2: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING FLUX FOR PRINTED BOARD ASSEMBLIES |
| EN ISO 9455-15:2017 | Soft soldering fluxes - Test methods - Part 15: Copper corrosion test (ISO 9455-15:2017) |
| ISO 9455-15:2017 | Soft soldering fluxes — Test methods — Part 15: Copper corrosion test |
| BS EN 29454-1:1994 | Soft soldering fluxes. Classification and requirements Classification, labelling and packaging |
| BS EN ISO 9455-3:1995 | Soft soldering fluxes. Test methods Determination of acid value, potentiometric and visual titration methods |
| EN 61189-5-2:2015 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies |
| DIN EN ISO 9455-12:1994-11 | SOFT SOLDERING FLUXES - TEST METHODS - PART 12: STEEL TUBE CORROSION TEST |
| EN 61189-5:2006 | Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies |
| UNE-EN ISO 9454-1:2016 | Soft soldering fluxes - Classification and requirements - Part 1: Classification, labelling and packaging (ISO 9454-1:2016) |
| UNE-EN ISO 9455-14:2018 | Soft soldering fluxes - Test methods - Part 14: Assessment of tackiness of flux residues (ISO 9455-14:2017) |
| UNE-EN ISO 9455-5:2015 | Soft soldering fluxes - Test methods - Part 5: Copper mirror test (ISO 9455-5:2014) |
Summarise
US$96.00
Excluding Tax where applicable
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