IEC 61189-5:2006

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Accuracy, precision and resolution
   3.1 Accuracy
   3.2 Precision
   3.3 Resolution
   3.4 Report
   3.5 Student's t distribution
   3.6 Suggested uncertainty limits
4 Catalogue of approved test methods
5 P: Preparation/conditioning test methods
   5.1 Test 5P01: Test-board design guideline
   5.2 Test 5P02: Standard mounting process for
         CSP/BGA packages
6 V: Visual test methods
7 D: Dimensional test methods
8 C: Chemical test methods
   8.1 Test 5C01: Corrosion, flux
9 M: Mechanical test methods
   9.1 Test 5M01: Peel test method for test-board
         land
10 E: Electrical test methods
   10.1 Test 5E01: Changes of the surface insulation
         resistance caused by fluxes
   10.2 Test 5E02: Surface insulation resistance,
         assemblies
11 N Environmental test methods
   11.1 Test 5N01: Reflow solderability test for
         soldering joint
   11.2 Test 5N02: Resistance to reflow solderability
         of test board
   11.3 Test 5N03: Solderability test for test-board
         land
12 X Miscellaneous test methods
   12.1 Test 5X01: Liquid flux activity, wetting balance
         method
   12.2 Test 5X02: Paste flux viscosity - T-Bar spindle
         method
   12.3 Test 5X03: Spread test, liquid or extracted
         solder flux, solder paste and extracted cored
         wires or preforms
   12.4 Test 5X04: Solder paste viscosity - T-Bar spin
         spindle method (applicable to 300 Pa.s to 1,600
         Pa.s)
   12.5 Test 5X05: Solder paste viscosity - T-Bar spindle
         method (applicable to Pa.s)
   12.6 Test 5X06: Solder paste viscosity - Spiral pump
         method (applicable to 300 Pa.s to 1,600 Pa.s)
   12.7 Test 5X07: Solder paste viscosity - Spiral pump
         method (applicable to 300 Pa.s)
   12.8 Test 5X08: Solder paste - Slump test
   12.9 Test 5X09: Solder paste - Solder ball test
   12.10 Test 5X10: Solder paste - Tack test
   12.11 Test 5X11: Solder paste - Wetting test
   12.12 Test 5X12: Flux residues - Tackiness after drying
   12.13 Test 5X13: Spitting of flux-cored wire solder
   12.14 Test 5X14: Solder pool test
Bibliography

IEC 61189-5:2006 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies.