JEDEC JEP150.01:2013
Superseded
Superseded
View Superseded by
STRESS-TEST-DRIVEN QUALIFICATION OF AND FAILURE MECHANISMS ASSOCIATED WITH ASSEMBLED SOLID STATE SURFACE-MOUNT COMPONENTS
Available format(s)
Hardcopy , PDF
Language(s)
English
Published date
06-01-2013
Publisher
Superseded date
12-11-2023
Superseded by
Free
Excluding Tax where applicable
This publication contains a set of frequently recommended and accepted JEDEC reliability stress tests.
| DocumentType |
Revision
|
| Pages |
24
|
| PublisherName |
JEDEC Solid State Technology Association
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
| JEDEC JESD93A:2022 | MULTICHIP MODULES (MCM) |
Summarise
Free
Excluding Tax where applicable
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