JEDEC JEP30-K100A:2025-09
Superseded
Superseded
View Superseded by
PartModel Design Rule Kits Guidelines for Electronic-Device Packages – XML Requirements
Available format(s)
Hardcopy , PDF
Language(s)
English
Published date
09-01-2025
Publisher
Superseded date
08-29-2026
Superseded by
Free
Excluding Tax where applicable
The JEP30 document establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products.
| DocumentType |
Standard
|
| Pages |
138
|
| PublisherName |
JEDEC Solid State Technology Association
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
| JEDEC JEP30-A100A:2023 | Part Model Assembly Process Classification Guidelines for Electronic-Device Packages – XML Requirements |
| JEDEC JEP30-T100B:2024 | Part Model Thermal Guidelines for Electronic-Device Packages – XML Requirements |
Summarise
Free
Excluding Tax where applicable