JEDEC JEP30-PX100:2025
Superseded
View Superseded by
PartModel Product Guidelines for Electronic-Device Substrates and Assemblies – XML Requirements
Hardcopy , PDF
English
09-01-2025
08-31-2026
The JEP30 document establishes the requirements for exchanging part data between part
manufacturers and their customers for electrical and electronic products.
| DocumentType |
Standard
|
| Pages |
40
|
| PublisherName |
JEDEC Solid State Technology Association
|
| Status |
Superseded
|
| SupersededBy |
| JEDEC JEP30H:2026 | PartModel Guidelines for Electronic-Device Packages – XML Requirements |
| JEDEC JEP 30-T100:2018 | PART MODEL THERMAL GUIDELINES FOR ELECTRONIC-DEVICE PACKAGES - XML REQUIREMENTS |
| JEDEC JEP30-A100B:2024 | Part Model Assembly Process Classification Guidelines for Electronic-Device Packages – XML Requirements |
| JEDEC JEP30-M100:2025 | PartModel Generated ECAD - Models Guidelines for Electronic-Device Packages – XML Requirements |
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