JEDEC JESD22-B113C:2025
Current
Board Level Cyclic Bend Test Method for Interconnect Reliability Characterization of SMT ICs for Handheld Electronic Products
Hardcopy , PDF
English
11-01-2025
The Board Level Cyclic Bend Test Method is intended to evaluate and compare the performance of SMT ICs in an accelerated test environment for handheld electronic products applications.
| DocumentType |
Test Method
|
| Pages |
24
|
| PublisherName |
JEDEC Solid State Technology Association
|
| Status |
Current
|
| Supersedes |
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