JEDEC JESD 22-B113B:2018
Superseded
View Superseded by
Board Level Cyclic Bend Test Method for Interconnect Reliability Characterization of SMT ICs for Handheld Electronic Products
Hardcopy , PDF
English
08-01-2018
12-24-2025
The Board Level Cyclic Bend Test Method is intended to evaluate and compare the performance of SMT ICs in an accelerated test environment for handheld electronic products applications.
| Committee |
JC-14.1
|
| DocumentType |
Test Method
|
| Pages |
26
|
| PublisherName |
JEDEC Solid State Technology Association
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
| IPC JEDEC-9704A:2012 | Printed Circuit Assembly Strain Gage Test Guideline |
| IPC J STD 033C-1:2014 | HANDLING, PACKING, SHIPPING AND USE OF MOISTURE, REFLOW, AND PROCESS SENSITIVE DEVICES |
| IPC-9701B:2022 | Thermal Cycling Test Method for Fatigue Life Characterization of Surface Mount Attachments |
| IPC J STD 020E:2015 | MOISTURE/REFLOW SENSITIVITY CLASSIFICATION FOR NONHERMETIC SURFACE MOUNT DEVICES |
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