JIS C 2570-1:2006
Withdrawn
Withdrawn
View Superseded by
Directly heated negative temperature coefficient thermistors -- Part 1: Generic specification
Published date
01-20-2006
Publisher
Withdrawn date
10-23-2025
Superseded by
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| DocumentType |
Standard
|
| ProductNote |
Supersedes JIS C2570 (05/2006)
|
| PublisherName |
Japanese Standards Association
|
| Status |
Withdrawn
|
| SupersededBy | |
| Supersedes |
2006 [20/01/2006]
| JIS C 60068-2-17:2001 | Basic environmental testing procedures -- Part 2: Tests -- Test Q: Sealing |
| JIS C 6484:2005 | Base materials for printed circuits -- Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test) |
| JIS C 60068-2-11:1989 | Basic environmental testing procedures Part 2: Tests -- Test Ka: Salt mist Part 2: Tests - Test Ka: Salt mist |
| JIS C 60068-2-13:1989 | Basic environmental testing procedures Part 2: Tests, Test M: Low air pressure Part 2: Tests, Test M: Low air pressure |
| JIS C 60068-1:1993 | Environmental testing Part 1: General and guidance Part 1: General and guidance |
| JIS C 60068-2-52:2000 | Environmental testing -- Part 2: Tests -- Test Kb: Salt mist, cyclic (sodium chloride solution) Part 2: Tests - Test Kb: Salt mist, cyclic (sodium, chloride solution) |
| JIS C 5062:2008 | Marking codes for resistors and capacitors |
| JIS C 60068-2-32:1995 | Environmental testing Part 2: Tests. Test Ed: Free fall Part 2: Tests. Test Ed: Free fall |
| JIS C 60068-2-21:2002 | Environmental testing -- Part 2-21: Tests -- Test U: Robustness of termination and integral mounting devices Part 2-21: Tests - Test U: Robustness of termination and integral mounting devices |
| JIS C 60068-2-45:1995 | Environmental testing procedures of electronic and electrical resistance to solvents (immersion in cleaning solvents) |
| JIS C 60068-2-20:1996 | Basic environmental testing procedures Part 2: Tests. Test T: Soldering Part 2: Tests. Test T: Soldering |
| JIS C 60068-2-58:2006 | Environmental testing -- Part 2: Tests -- Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) |
| JIS C 2570-2:2008 | Directly heated negative temperature coefficient thermistors -- Part 2: Sectional specification -- Surface mount negative temperature coefficient thermistors |
Summarise
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