MIL-C-47224 Revision B:1993
Current
Current
The latest, up-to-date edition.
COMPOUND, MOLDING, TRANSFER, EPOXY RESIN, SINGLE COMPONENT
Available format(s)
PDF
Publisher
Specifies one type of single-component, epoxy resin transfer molding compound for potting, encapsulating, and embedding electrical devices requiring good thermal conductivity.
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