MIL-C-82644 Base Document:1975
Withdrawn
Compounds, Epoxy, Encapsulating (No S/S Document)
01-27-1975
10-15-1996
Covers cured compounds used for casting shapes, for encapsulating: electronic parts and assemblies, transformers, conductors, coils and for sealing terminal wires and connector contacts.
| DocumentType |
Standard
|
| Pages |
13
|
| PublisherName |
US Military Specs/Standards/Handbooks
|
| Status |
Withdrawn
|
| Standards | Relationship |
| SAE AMS3731C | Similar to |
| SAE AMS3731/2D | Similar to |
| MIL-STD-129 Revision R:2014 | Military Marking for Shipment and Storage |
| FED-STD-406 Revision A:1982 | PLASTICS: METHODS OF TESTING (S/S BY - SEE CANCELLATION NOTICE FOR RECOMMENDED SUPERSEDING ASTM TEST METHODS) |
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