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SAE AMS3731/2D

Withdrawn

Withdrawn

Potting Compound, Epoxy Bisphenol A-Type Filled, Heat Cure, Low CTE Thermal Shock Resistant

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

09-22-2016

Withdrawn date

09-22-2016

US$88.50
Excluding Tax where applicable

1. SCOPE
2. APPLICABLE DOCUMENTS
3. TECHNICAL REQUIREMENTS
4. QUALITY ASSURANCE PROVISIONS
5. PREPARATION FOR DELIVERY
6. ACKNOWLEDGMENT
7. REJECTIONS
8. NOTES

Specifies a filled epoxy resin formulation, supplied as a two-component system, requiring an oven cure for attainment of maximum properties.

DevelopmentNote
Supersedes SAE AMS 3735 (08/2001)
DocumentType
Standard
Pages
4
PublisherName
SAE International
Status
Withdrawn
Supersedes

This specificiation covers a filled epoxy resin formulation, supplied as a two-component system, requiring an oven cure for attainment of maximum properties.

Standards Relationship
MIL-I-16923 Revision H:1991 Similar to
MIL-C-82644 Base Document:1975 Similar to

US$88.50
Excluding Tax where applicable