MIL S 55620 : 0
Superseded
View Superseded by
SUBSTRATES, CERAMIC, FOR DEPOSITION OF THIN FILM MICROCIRCUITS
English
07-23-2013
Describes wafer size ceramic substrates of alumina, beryllia or single crystal sapphire materials, for deposition of thin film microcircuits.
| DocumentType |
Standard
|
| Pages |
18
|
| PublisherName |
US Military Specs/Standards/Handbooks
|
| Status |
Superseded
|
| SupersededBy |
| MIL-P-11268 Revision L:1983 | PARTS, MATERIALS, AND PROCESSES USED IN ELECTRONIC EQUIPMENT (NO S/S DOCUMENT) |
| MIL-STD-129 Revision R:2014 | Military Marking for Shipment and Storage |
| PPP-B-636 Revision J:1981 | Boxes, Shipping, Fiberboard (S/S by ASTM-D1974 and ASTM-D5118) |
| ASME B46.1 : 2009 | SURFACE TEXTURE (SURFACE ROUGHNESS, WAVINESS, AND LAY) |
| ASTM D 202 : 2017 : REDLINE | Standard Test Methods for Sampling and Testing Untreated Paper Used for Electrical Insulation |
| PPP-T-60 Revision E:1986 | Tape: Packaging, Waterproof (S/S by ASTM D5486/ASTM-D5486M) |
| MIL-I-10 Revision B:1966 | Insulating Compound, Electrical, Ceramic, Class L (No S/S Document) |
| MIL-STD-105 Revision E:1989 | Sampling Procedures and Tables for Inspection by Attributes (See Notice 3 for Replacement Information) |
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