NEN EN IEC 60749-19 : 2003 AMD 1 2010
Current
Current
The latest, up-to-date edition.
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 19: DIE SHEAR STRENGTH
Published date
01-12-2013
Publisher
Determines the integrity of materials and procedures used to attach semiconductor die to packaging headers or other substrates generally only applicable to cavity packages or as a process monitor.
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