NEN EN IEC 61190-1-3 : 2007 AMD 1 2010
Withdrawn
Withdrawn
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ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS
Published date
01-12-2013
Publisher
Withdrawn date
04-01-2018
Superseded by
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Defines the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic soldering applications and for "special" electronic grade solders.
| DocumentType |
Standard
|
| PublisherName |
Netherlands Standards
|
| Status |
Withdrawn
|
| SupersededBy |
| Standards | Relationship |
| IEC 61190-1-3:2007+AMD1:2010 CSV | Identical |
| EN 61190-1-3:2007/A1:2010 | Identical |
Summarise
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