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NEN EN IEC 61190-1-3 : 2007 AMD 1 2010

Withdrawn

Withdrawn

A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

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withdrawn

A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS

Withdrawn date

04-01-2018

Published date

01-12-2013

Defines the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic soldering applications and for "special" electronic grade solders.

DocumentType
Standard
PublisherName
Netherlands Standards
Status
Withdrawn
SupersededBy

Standards Relationship
IEC 61190-1-3:2007+AMD1:2010 CSV Identical
EN 61190-1-3:2007/A1:2010 Identical

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