NEN-EN-IEC 61190-1-3:2018
Current
Current
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
Published date
04-01-2018
Publisher
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Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
| Committee |
TC 91
|
| DocumentType |
Standard
|
| PublisherName |
Netherlands Standards
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| IEC 61190-1-3:2017 | Identical |
| EN IEC 61190-1-3:2018 | Identical |
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