NEN NPR IEC/TR 62866 : 2014
Current
Current
ELECTROCHEMICAL MIGRATION IN PRINTED WIRING BOARDS AND ASSEMBLIES - MECHANISMS AND TESTING
Published date
05-27-2014
Publisher
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Explains the history of the degradation of printed wiring boards caused by electrochemical migration, the measurement method, observation of the failure and remarks to testing in detail.
| DocumentType |
Standard
|
| PublisherName |
Netherlands Standards
|
| Status |
Current
|
| Standards | Relationship |
| IEC TR 62866:2014 | Identical |
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