IEC TR 62866:2014
Current
Electrochemical migration in printed wiring boards and assemblies - Mechanisms and testing
Hardcopy , PDF
English - French
05-07-2014
FOREWORD
INTRODUCTION
1 Scope
2 Electrochemical migration
3 Test conditions and specimens
4 Test methods
5 Electrical tests
6 Evaluation of failures and analysis
Annex A (informative) - Life evaluation
Annex B (informative) - Measurement of temperature-humidity
Bibliography
IEC TR 62866:2014 describes the history of the degradation of printed wiring boards caused by electrochemical migration, the measurement method, observation of the failure and remarks to testing in detail.
| Committee |
TC 91
|
| DevelopmentNote |
Stability Date: 2020 (11/2017)
|
| DocumentType |
Technical Report
|
| Pages |
187
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Standards | Relationship |
| NEN NPR IEC/TR 62866 : 2014 | Identical |
| PD IEC/TR 62866:2014 | Identical |
| BS EN 60079-27:2008 | Identical |
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