PD IEC/TR 62866:2014
Current
Electrochemical migration in printed wiring boards and assemblies. Mechanisms and testing
Hardcopy , PDF
English
05-07-2014
| Committee |
EPL/501
|
| DocumentType |
Standard
|
| Pages |
96
|
| PublisherName |
British Standards Institution
|
| Status |
Current
|
This Technical Report describes the history of the degradation of printed wiring boards caused by electrochemical migration, the measurement method, observation of the failure and remarks to testing in detail.
| Standards | Relationship |
| IEC TR 62866:2014 | Identical |
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