HD 323.2.20 : 200S3
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BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST T - SOLDERING
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IEC 61188-1-2:1998
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Printed boards and printed board assemblies - Design and use - Part 1-2: Generic requirements - Controlled impedance
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IEC 60068-1:2013
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Environmental testing - Part 1: General and guidance
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EN 60454-3-1:1998/A1:2001
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PRESSURE-SENSITIVE ADHESIVE TAPES FOR ELECTRICAL PURPOSES - SPECIFICATIONS FOR INDIVIDUAL MATERIALS - PVC FILM TAPES WITH PRESSURE-SENSITIVE ADHESIVE
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IEC 60068-2-20:2008
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Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
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IEC 61190-1-2:2014
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Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
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EN 61190-1-1:2002
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Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
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EN 60068-1:2014
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Environmental testing - Part 1: General and guidance
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EN 62326-4-1:1997
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Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1: Capability Detail Specification - Performance levels A, B and C
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EN 61188-1-2:1998
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Printed boards and printed board assemblies - Design and use - Part 1-2: Generic requirements - Controlled impedance
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IEC 60454-1:1992
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Specifications for pressure-sensitive adhesive tapes for electrical purposes - Part 1: General requirements
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IEC 60454-3-1:1998+AMD1:2001 CSV
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Pressure-sensitive adhesive tapes for electrical purposes - Part 3: Specifications for individual materials - Sheet 1: PVC film tapes with pressure-sensitive adhesive
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EN ISO 9002:1994/AC:1997
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QUALITY SYSTEMS - SPECIFICATION FOR PRODUCTION AND INSTALLATION
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IEC 61189-1:1997+AMD1:2001 CSV
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Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology
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IEC 62326-4:1996
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Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification
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EN ISO 9453:2014
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Soft solder alloys - Chemical compositions and forms (ISO 9453:2014)
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IEC 61190-1-1:2002
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Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
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EN 60584-1:2013
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Thermocouples - Part 1: EMF specifications and tolerances
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EN 60454-1:1994
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Specifications for pressure-sensitive adhesive tapes for electrical purposes - Part 1: General requirements
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ISO 4046:1978
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Paper, board, pulp and related terms — Vocabulary
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ISO 9453:2014
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Soft solder alloys Chemical compositions and forms
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EN 60068-2-78:2013
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Environmental testing - Part 2-78: Tests - Test Cab: Damp heat, steady state
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IEC 62326-4-1:1996
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Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1: Capability detail specification - Performance levels A, B and C
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EN 61189-1 : 97 AMD 1 2001
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TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 1: GENERAL TEST METHODS AND METHODOLOGY
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EN 62326-4:1997
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Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification
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EN 60695-11-5:2017
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Fire hazard testing - Part 11-5: Test flames - Needle-flame test method - Apparatus, confirmatory test arrangement and guidance
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IEC 60695-11-5 : 2.0
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FIRE HAZARD TESTING - PART 11-5: TEST FLAMES - NEEDLE-FLAME TEST METHOD - APPARATUS, CONFIRMATORY TEST ARRANGEMENT AND GUIDANCE
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EN 61190-1-2:2014
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Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
|
IEC 60584-1:2013
|
Thermocouples - Part 1: EMF specifications and tolerances
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