ASTM F 2113 : 2001 : EDT 1
|
Standard Guide for Analysis and Reporting the Impurity Content and Grade of High Purity Metallic Sputtering Targets for Electronic Thin Film Applications
|
ASTM E 1001 : 2016 : REDLINE
|
Standard Practice for Detection and Evaluation of Discontinuities by the Immersed Pulse-Echo Ultrasonic Method Using Longitudinal Waves
|
ASTM F 2405 : 2004
|
Standard Test Method for Trace Metallic Impurities in High Purity Copper by High-Mass-Resolution Glow Discharge Mass Spectrometer
|
ASTM F 1512 : 1994 : R1999
|
Standard Practice for Ultrasonic C-Scan Bond Evaluation of Sputtering Target-Backing Plate Assemblies
|
ASTM B 209 : 2014
|
Standard Specification for Aluminum and Aluminum-Alloy Sheet and Plate
|
ASTM E 1001 : 2021
|
Standard Practice for Detection and Evaluation of Discontinuities by the Immersed Pulse-Echo Ultrasonic Method Using Longitudinal Waves
|
ASTM F 2405 : 2004 : R2011
|
Standard Test Method for Trace Metallic Impurities in High Purity Copper by High-Mass-Resolution Glow Discharge Mass Spectrometer (Withdrawn 2020)
|
ASTM F 2113 : 2001 : R2011
|
Standard Guide for Analysis and Reporting the Impurity Content and Grade of High Purity Metallic Sputtering Targets for Electronic Thin Film Applications (Withdrawn 2020)
|
ASTM E 1001 : 2011
|
Standard Practice for Detection and Evaluation of Discontinuities by the Immersed Pulse-Echo Ultrasonic Method Using Longitudinal Waves
|
ASTM E 1001 : 1999 : REV A
|
Standard Practice for Detection and Evaluation of Discontinuities by the Immersed Pulse-Echo Ultrasonic Method Using Longitudinal Waves
|
ASTM F 1512 : 1994 : R2003
|
Standard Practice for Ultrasonic C-Scan Bond Evaluation of Sputtering Target-Backing Plate Assemblies
|
ASTM B 248 : 2017
|
Standard Specification for General Requirements for Wrought Copper and Copper-Alloy Plate, Sheet, Strip, and Rolled Bar
|
ASTM E 1001 : 2016
|
Standard Practice for Detection and Evaluation of Discontinuities by the Immersed Pulse-Echo Ultrasonic Method Using Longitudinal Waves
|
ASTM F 2113 : 2001
|
Standard Guide for Analysis and Reporting the Impurity Content and Grade of High Purity Metallic Sputtering Targets for Electronic Thin Film Applications
|
ASTM B 209 : 2014 : REDLINE
|
Standard Specification for Aluminum and Aluminum-Alloy Sheet and Plate
|
ASTM E 1001 : 2006
|
Standard Practice for Detection and Evaluation of Discontinuities by the Immersed Pulse-Echo Ultrasonic Method Using Longitudinal Waves
|
ASTM F 1512 : 1994 : R2011
|
Standard Practice for Ultrasonic C-Scan Bond Evaluation of Sputtering Target-Backing Plate Assemblies (Withdrawn 2020)
|
ASTM E 112 : 2013 : R2021
|
Standard Test Methods for Determining Average Grain Size
|
ASTM E 112 : 2013
|
Standard Test Methods for Determining Average Grain Size
|
ASTM B 248 : 2022
|
Standard Specification for General Requirements for Wrought Copper and Copper-Alloy Plate, Sheet, Strip, and Rolled Bar
|
ASTM E 1001 : 2004
|
Standard Practice for Detection and Evaluation of Discontinuities by the Immersed Pulse-Echo Ultrasonic Method Using Longitudinal Waves
|
ASTM B 248 : 2017 : REDLINE
|
Standard Specification for General Requirements for Wrought Copper and Copper-Alloy Plate, Sheet, Strip, and Rolled Bar
|
ASTM F 2113 : 2001 : R2007
|
Standard Guide for Analysis and Reporting the Impurity Content and Grade of High Purity Metallic Sputtering Targets for Electronic Thin Film Applications
|