Semiconductor devices. Micro-electromechanical devices Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT)

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Hardcopy , PDF

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English

Published date

22-07-2020

Publisher

British Standards Institution

This part of IEC 62047 specifies a method for assessing the bond strength of glass frit bonded structures using micro-chevron-tests (MCT).

IEC62047-27:2017(E) specifies a method for assessing the bond strength of glass frit bonded structures using micro-chevron-tests (MCT). It describes suitable sample geometry and provides guidance for the design of deviating sample geometries.
The micro-chevron-test is an experimental method to determine the fracture toughness KIC of brittle materials or bond interfaces using specifically designed test chips (micro-chevron-samples) under defined load conditions (crack opening mode I). Owing to its high precision and low variance, it is suitable for analysing the influence of different process parameters on bond strength as well as for quality assurance.

Committee	EPL/47
DocumentType	Standard
ISBN	9780580899096
Pages	20
PublisherName	British Standards Institution
Status	Current

Standards	Relationship
IEC 62047-27:2017	Identical

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BS IEC 62047-27:2017

Semiconductor devices. Micro-electromechanical devices Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT)

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