Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)

Published date

22-10-2001

Publisher

European Committee for Standards - Electrical

FOREWORD
1 Scope
2 Normative references
3 Definitions
Annex ZA (normative) Normative references to international
publications with their corresponding European
publications

Provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch ball grid array the terminal pitch of which is less than or equal to 0,80 mm.

Committee	CLC/SR 47D
DocumentType	Standard
PublisherName	European Committee for Standards - Electrical
Status	Current

Standards	Relationship
NF EN 60191-6-5 : 2002	Identical
IEC 60191-6-5:2001	Identical
CEI EN 60191-6-5 : 2002	Identical
NBN EN 60191 6-5 : 2002	Identical
PN EN 60191-6-5 : 2002	Identical
NEN EN IEC 60191-6-5 : 2001	Identical
UNE-EN 60191-6-5:2002	Identical
BS EN 60191-6-5:2001	Identical
I.S. EN 60191-6-5:2002	Identical
DIN EN 60191-6-5:2002-05	Identical

CEI EN 60191-6-17 : 2012	MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-17: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR STACKED PACKAGES - FINE-PITCH BALL GRID ARRAY AND FINE-PITCH LAND GRID ARRAY (P-PFBGA AND P-PFLGA)
BS EN 60191-6-18:2010	Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for ball grid array (BGA)
I.S. EN 60191-6-17:2011	MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-17: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR STACKED PACKAGES - FINE-PITCH BALL GRID ARRAY AND FINE-PITCH LAND GRID ARRAY (P-PFBGA AND P-PFLGA)
EN 60191-6-18:2010	Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
EN 60191-6-17:2011	Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)
EN 62137:2004/corrigendum:2005	ENVIRONMENTAL AND ENDURANCE TESTING - TEST METHODS FOR SURFACE-MOUNT BOARDS OF AREA ARRAY TYPE PACKAGES FBGA, BGA, FLGA, LGA, SON AND QFN
BS EN 60191-6-19:2010	Mechanical standardization of semiconductor devices Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage
BS EN 62137:2004	Environmental and endurance testing. Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN
BS EN 62137-4:2014	Electronics assembly technology Endurance test methods for solder joint of area array type package surface mount devices
BS EN 60191-6-17:2011	Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for stacked packages. Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)
CEI EN 60191-6-19 : 2011	MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-19: MEASUREMENT METHODS OF THE PACKAGE WARPAGE AT ELEVATED TEMPERATURE AND THE MAXIMUM PERMISSIBLE WARPAGE
I.S. EN 62137:2005	ENVIRONMENTAL AND ENDURANCE TESTING - TEST METHODS FOR SURFACE-MOUNT BOARDS OF AREA ARRAY TYPE PACKAGES FBGA, BGA, FLGA, LGA, SON AND QFN
I.S. EN 62137-4:2014	ELECTRONICS ASSEMBLY TECHNOLOGY - PART 4: ENDURANCE TEST METHODS FOR SOLDER JOINT OF AREA ARRAY TYPE PACKAGE SURFACE MOUNT DEVICES
I.S. EN 60191-6-19:2010	MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-19: MEASUREMENT METHODS OF THE PACKAGE WARPAGE AT ELEVATED TEMPERATURE AND THE MAXIMUM PERMISSIBLE WARPAGE
EN 60191-6-19:2010	Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage
EN 62137-4:2014/AC:2015	ELECTRONICS ASSEMBLY TECHNOLOGY - PART 4: ENDURANCE TEST METHODS FOR SOLDER JOINT OF AREA ARRAY TYPE PACKAGE SURFACE MOUNT DEVICES (IEC 62137-4:2014)

IEC 60191-6:2009

Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages

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EN 60191-6-5:2001

Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)

Table of Contents

Abstract

General Product Information

International Equivalents

Standards Referenced By This Book

Standards Referencing This Book

Category

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