EN 60191-6-5:2001
Current
Current
The latest, up-to-date edition.
Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)
Published date
22-10-2001
Sorry this product is not available in your region.
Summarise this standard
AI-generated summary
FOREWORD
1 Scope
2 Normative references
3 Definitions
Annex ZA (normative) Normative references to international
publications with their corresponding European
publications
Provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch ball grid array the terminal pitch of which is less than or equal to 0,80 mm.
| Committee |
CLC/TC 47X
|
| DocumentType |
Standard
|
| PublisherName |
European Committee for Standards - Electrical
|
| Status |
Current
|
| Standards | Relationship |
| NF EN 60191-6-5 : 2002 | Identical |
| IEC 60191-6-5:2001 | Identical |
| CEI EN 60191-6-5 : 2002 | Identical |
| NBN EN 60191 6-5 : 2002 | Identical |
| PN EN 60191-6-5 : 2002 | Identical |
| NEN EN IEC 60191-6-5 : 2001 | Identical |
| BS EN 60191-6-5:2001 | Identical |
| I.S. EN 60191-6-5:2002 | Identical |
| DIN EN 60191-6-5:2002-05 | Identical |
| BS EN 60318-1:2009 | Identical |
| UNE-EN 60191-6-5:2002 | Identical |
Sorry this product is not available in your region.