IEC 60191-6-17:2011
Current
The latest, up-to-date edition.
Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)
Hardcopy , PDF 1 User , PDF 3 Users , PDF 5 Users , PDF 9 Users
English, English - French
27-01-2011
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Definitions
4 Terminal position numbering
5 Drawings
6 Dimensions
7 Dimension table
IEC 60191-6-17:2011 provides outline drawings and dimensions for stacked packages and individual stackable packages in the form of FBGA or FLGA.
| Committee |
TC 47/SC 47D
|
| DevelopmentNote |
Stability Date: 2017. (10/2012)
|
| DocumentType |
Standard
|
| Pages |
58
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Standards | Relationship |
| NF EN 60191-6-17 : 2012 | Identical |
| NEN EN IEC 60191-6-17 : 2011 | Identical |
| I.S. EN 60191-6-17:2011 | Identical |
| BS EN 60191-6-17:2011 | Identical |
| CEI EN 60191-6-17 : 2012 | Identical |
| EN 60191-6-17:2011 | Identical |
| DIN EN 60191-6-17:2011-09 | Identical |
| UNE-EN 60191-6-17:2011 | Identical |
| BS EN 60068-2-58:2004 | Identical |
| IEC 60191-6:2009 | Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages |
| IEC 60191-6-5:2001 | Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA) |
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