![header thumbnail](/images/publishers\semi_cover.gif)
SEMI 3D10 : 2014(R2020)
Current
The latest, up-to-date edition.
![header thumbnail](/images/publishers\semi_cover.gif)
Guide to Describing Materials Properties for Intermediate Wafers for Use in a 300 mm 3DS-IC Wafer Stack
Hardcopy
English
01-04-2020
This Guide is intended to address the needs of the 3D Stacked IC (3DS-IC) industry by providing the tools needed to procure processed wafers to be used in a 3DS-IC process.
Access your standards online with a subscription
Features
-
Simple online access to standards, technical information and regulations.
-
Critical updates of standards and customisable alerts and notifications.
-
Multi-user online standards collection: secure, flexible and cost effective.