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SEMI 3D11 : 2014

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

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superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

TERMINOLOGY FOR THROUGH GLASS VIA AND BLIND VIA IN GLASS GEOMETRICAL METROLOGY

Superseded date

05-10-2020

Published date

06-01-2015

Specifies clear and commonly accepted definitions of through glass vias (TGV) and to provide a consistent terminology for the understanding and discussion of metrology issues important them.

DevelopmentNote
Not available for sale from ILI, customer to contact SEMI. (12/2014)
DocumentType
Standard
PublisherName
Semiconductor Equipment & Materials Institute
Status
Superseded
SupersededBy

SEMI 3D16 : 2016 SPECIFICATION FOR GLASS BASE MATERIAL FOR SEMICONDUCTOR PACKAGING

SEMI E89 : 2007(R2013) GUIDE FOR MEASUREMENT SYSTEM ANALYSIS (MSA)
SEMI P35 : 2006(R2013) TERMINOLOGY FOR MICROLITHOGRAPHY METROLOGY

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