SEMI 3D8:2021
Current
Current
The latest, up-to-date edition.
Guide for Describing Silicon Wafers for Use as 300 mm Carrier Wafers in a 3DS-IC Temporary Bond-Debond (TBDB) Process
Available format(s)
Hardcopy
Language(s)
English
Published date
01-11-2021
This Guide is intended to address the needs of the 3D Stacked IC (3DS-IC) industry by defining the items/parameters needed to procure virgin silicon carrier wafers to be used in a 3DS-IC process.
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