IEC 62137-1-1:2007
Current
The latest, up-to-date edition.
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
English, English - French
11-07-2007
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 General remarks
5 Test equipment and materials
5.1 Flow soldering equipment
5.2 Reflow soldering equipment
5.3 Pull strength test equipment
5.4 Optical microscope
5.5 Test substrate
5.6 Solder alloy
5.7 Flux for flow soldering
5.8 Solder paste
6 Mounting method
6.1 Flow soldering
6.2 Reflow soldering
7 Test conditions
7.1 Test: Rapid change of temperature
7.2 Pull strength test
8 Test procedure
8.1 Test sequence
8.2 Pre-conditioning
8.3 Initial pull strength measurement
8.4 Rapid change of temperature
8.5 Recovery
8.6 Intermediate/final pull strength measurement
9 Items to be included in the test report
10 Items to be given in the product specification
Annex A (normative) Pull strength test - Details
Bibliography
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