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05/30135664 DC : DRAFT JUN 2005

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

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superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

IEC 60749-37 ED. 1 - SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 37: BOARD LEVEL DROP TEST METHOD FOR HANDHELD ELECTRONIC PRODUCTS

Superseded date

30-05-2008

Published date

23-11-2012

1 Object and scope
2 Normative references
3 Terms and definitions
4 Test apparatus and components
  4.1 Test apparatus
  4.2 Test components
  4.3 Test board
  4.4 Test board assembly
  4.5 Number of components and sample size
5 Test Procedure
  5.1 Test equipment and parameters
  5.2 Pre-test characterization
  5.3 Drop testing
6 Failure criteria and failure analysis
7 Reporting
Annex A (informative) Preferred board construction, material,
                       design and layout
                       A.1 Preferred board construction, material
                           and design
                       A.2 Preferred test board size, layout,
                           and component locations
Figures
Tables

Committee
EPL/47
DocumentType
Draft
PublisherName
British Standards Institution
Status
Superseded
SupersededBy

IEC 60749-20:2008 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
IEC 60749-10:2002 Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock
IEC 60749-20-1:2009 Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat

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