09/30208696 DC : 0
Superseded
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BS EN 61189-11 ED.1 - TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 11: MEASUREMENT OF MELTING TEMPERATURE AND MELTING TEMPERATURE RANGES OF SOLDER ALLOYS
Hardcopy , PDF
English
31-07-2013
1 Scope
2 Normative reference
3 Test and definition
3.1 Melting temperature ranges
3.2 Solidus temperature
3.3 Liquidus temperature
3.4 DSC curve
4 Test Equipment
4.1 DSC
4.2 Balance
4.3 Pans
4.4 Inert gas
4.5 alumina powder
5 Calibration of the temperature
6 Test condition
6.1 Sample size
6.2 Inert gas flow
6.3 Heating rate
7 Procedure for measuring the DSC curve
8 Solidus temperature: Temperature of melting starts
9 Liquidus temperature: Temperature of melting ends
Annex A (Normative) - Test report on melting temperature
ranges of solder alloys
Annex B (Informative) - Example of test result (liquidus
temperature)
BS EN 61189-11 ED.1
| Committee |
EPL/501
|
| DocumentType |
Draft
|
| Pages |
11
|
| PublisherName |
British Standards Institution
|
| Status |
Superseded
|
| SupersededBy |
| IEC 61189-1:1997+AMD1:2001 CSV | Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology |
| ISO 9453:2014 | Soft solder alloys — Chemical compositions and forms |
| ISO 11357-1:2016 | Plastics — Differential scanning calorimetry (DSC) — Part 1: General principles |
| IEC 61190-1-3:2007+AMD1:2010 CSV | Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications |
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