11/30243259 DC : 0
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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BS EN 60068-2-58 ED.4 - ENVIRONMENTAL TESTING - PART 2-58: TESTS TD- TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD)
Hardcopy , PDF
English
31-05-2015
1 Scope and object
2 Normative references
3 Terms and definitions
4 Grouping of soldering processes and related
test severities
5 Test equipment
6 Test Td1: Solderability of terminations
7 Test Td2: Resistance to soldering heat
8 Test Td3: Dewetting and resistance to dissolution
of metallization
9 Final measurements
10 Information to be given in the relevant specification
Bibliography
Annex A (normative) - Criteria for visual examination
Annex B (informative) - Guidance
Annex C (normative) - Application of the test methods
to through hole reflow soldering components (THR)
Annex D (informative) - Group 3: T4 related to size and
sensitivity for non-solid component
BS EN 60068-2-58 ED.4
| Committee |
EPL/501
|
| DocumentType |
Draft
|
| Pages |
28
|
| PublisherName |
British Standards Institution
|
| Status |
Superseded
|
| SupersededBy |
| IEC 60749-20:2008 | Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat |
| IEC 60068-1:2013 | Environmental testing - Part 1: General and guidance |
| IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| IEC 61190-1-2:2014 | Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly |
| IEC 61249-2-7:2002 | Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad |
| IEC 61760-1:2006 | Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs) |
| IEC 61760-4:2015 | Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices |
| IEC 61760-3:2010 | Surface mounting technology - Part 3: Standard method for the specification of components for through hole reflow (THR) soldering |
| IEC 60068-2-54:2006 | Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method |
| IEC 61190-1-1:2002 | Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly |
| IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
| IEC 61191-2:2017 | Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies |
| IEC 60068-2-44:1995 | Environmental testing - Part 2-44: Tests - Guidance on test T: Soldering |
| IPC J STD 020D-1:2008 | MOISTURE/REFLOW SENSITIVITY CLASSIFICATION FOR NONHERMETIC SURFACE MOUNT DEVICES |
| IEC 60068-2-69:2017 | Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method |
| IEC 61190-1-3:2007+AMD1:2010 CSV | Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications |
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