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Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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BS EN 60384-1 - FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
Hardcopy , PDF
English
31-10-2016
FOREWORD
1 General
2 Technical data
3 Quality assessment procedures
4 Tests and measurement procedures
Annex A (normative) - Interpretation of sampling plans and procedures
as described in IEC 60410 for use within the IECQ system
Annex B (normative) - Rules for the preparation of detail specifications
for capacitors and resistors for electronic equipment for
use within the IECQ system
Annex C (normative) - Layout of the first page of a PCP/CQC
specification
Annex D (normative) - Requirements for capability approval test report
Annex E (informative) - Guide for pulse testing of capacitors
Annex F (informative) - Guidance for the extension of endurance
tests on fixed capacitors
Annex G (normative) - Damp heat, steady state with voltage applied,
for metallized film capacitors only
Annex H (normative) - Accelerated damp heat, steady state, for
multilayer ceramic capacitors only
Annex Q (normative) - Quality assessment procedures
Bibliography
BS EN 60384-1.
| Committee |
EPL/40X
|
| DocumentType |
Draft
|
| Pages |
74
|
| PublisherName |
British Standards Institution
|
| Status |
Superseded
|
| SupersededBy |
| IEC 60068-2-82:2007 | Environmental testing - Part 2-82: Tests - Test XW1: Whisker test methods for electronic and electric components |
| IEC 61193-2:2007 | Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of electronic components and packages |
| IEC 60068-1:2013 | Environmental testing - Part 1: General and guidance |
| IEC 60068-2-58:2015+AMD1:2017 CSV | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) |
| IEC 60068-2-27:2008 | Environmental testing - Part 2-27: Tests - Test Ea and guidance: Shock |
| IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| IECQ 001002-3:2005 | IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ) - RULES OF PROCEDURE - PART 3: APPROVAL PROCEDURES |
| IEC 61249-2-7:2002 | Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad |
| IEC 60068-2-21:2006 | Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices |
| IEC 60068-2-13:1983 | Basic environmental testing procedures - Part 2-13: Tests - Test M: Low air pressure |
| ISO 3:1973 | Preferred numbers — Series of preferred numbers |
| IEC 60068-2-67:1995 | Environmental testing - Part 2-67: Tests - Test Cy: Damp heat, steady state, accelerated test primarily intended for components |
| IEC 60469-1:1987 | Pulse techniques and apparatus. Part 1: Pulse terms and definitions |
| IEC 60410:1973 | Sampling plans and procedures for inspection by attributes |
| IEC 60294:2012 | Measurement of the dimensions of a cylindrical component with axial terminations |
| IEC 60068-2-54:2006 | Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method |
| IEC 60068-2-17:1994 | Basic environmental testing procedures - Part 2-17: Tests - Test Q: Sealing |
| IEC 60068-2-2:2007 | Environmental testing - Part 2-2: Tests - Test B: Dry heat |
| IEC 60062:2016 | Marking codes for resistors and capacitors |
| ISO 80000-1:2009 | Quantities and units — Part 1: General |
| IEC 60063:2015 | Preferred number series for resistors and capacitors |
| ISO 9000:2015 | Quality management systems — Fundamentals and vocabulary |
| IEC 60717:2012 | Method for the determination of the space required by capacitors and resistors with unidirectional terminations |
| IEC 60068-2-1:2007 | Environmental testing - Part 2-1: Tests - Test A: Cold |
| IEC 60469-2:1987 | Pulse techniques and apparatus. Part 2: Pulse measurement and analysis, general considerations |
| IEC 60068-2-14:2009 | Environmental testing - Part 2-14: Tests - Test N: Change of temperature |
| IEC 60068-2-69:2017 | Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method |
| IEC 60068-2-30:2005 | Environmental testing - Part 2-30: Tests - Test Db: Damp heat, cyclic (12 h + 12 h cycle) |
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