14/30296140 DC : 0
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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BS EN 62047-25 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 25: SILICON-BASED MEMS FABRICATION TECHNOLOGY - MEASUREMENT METHOD OF PULL-PRESS AND SHEARING STRENGTH OF MICRO BONDING AREA
Hardcopy , PDF
English
30-11-2016
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Requirements
5 Testing method
Annex A (informative) - Dimensions for testing structure
and compressive/tensile strength
Annex B (informative) - Pull-press testing method example
BS EN 62047-25.
| Committee |
EPL/47
|
| DocumentType |
Draft
|
| Pages |
21
|
| PublisherName |
British Standards Institution
|
| Status |
Superseded
|
| SupersededBy |
| IEC 62047-9:2011 | Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS |
| IEC 62047-1:2016 | Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions |
| ISO 10012:2003 | Measurement management systems — Requirements for measurement processes and measuring equipment |
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