17/30352696 DC : DRAFT SEP 2017
Current
Current
The latest, up-to-date edition.
BS IEC 62047-31 ED1.0 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 31: FOUR-POINT BENDING TEST METHOD FOR INTERFACIAL ADHESION ENERGY OF LAYERED MEMS MATERIALS
Published date
21-09-2017
Publisher
FOREWORD
1 Scope
2 Normative references
3 Terms and symbols
4 Test piece
5 Testing method and test apparatus
6 Test report
Bibliography
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