17/30365636 DC : 0
NA
Status of Standard is Unknown
BS EN 62239-1 ED.1.0 - PROCESS MANAGEMENT FOR AVIONICS - MANAGEMENT PLAN - PART 1: PREPARATION AND MAINTENANCE OF AN ELECTRONIC COMPONENTS MANAGEMENT PLAN
Hardcopy , PDF
English
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms, definitions and abbreviations
4 Technical requirements
5 Plan administration requirements
Annex A (informative) - Requirement matrix
for IEC TS 62239-1
Annex B (informative) - Typical qualification
requirements and typical component minimum
qualification requirements
Annex C (informative) - Semiconductor reliability
and wear out
Annex D (informative) - Guidelines for environmental
protection techniques and for comparison of
components specifications
Bibliography
BS EN 62239-1 Ed.1.0.
| Committee |
GEL/107
|
| DocumentType |
Draft
|
| Pages |
86
|
| PublisherName |
British Standards Institution
|
| Status |
NA
|
| SAE ARP6379 | Processes for Application-Specific Qualification of Electrical, Electronic, and Electromechanical Parts and Sub-Assemblies for Use in Aerospace, Defense, and High Performance Systems |
| SAE AS5553B | Counterfeit Electrical, Electronic, and Electromechanical (EEE) Parts; Avoidance, Detection, Mitigation, and Disposition |
| GEIA HB 0005-2 : 2007 | TECHNICAL GUIDELINES FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER AND FINISHES |
| GEIA STD 0005-3 : 2013 | PERFORMANCE TESTING FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC INTERCONNECTS CONTAINING PB-FREE SOLDER AND FINISHES |
| SAE AS6171 | Test Methods Standard; General Requirements, Suspect/Counterfeit, Electrical, Electronic, and Electromechanical Parts |
| MIL-STD-883 Revision K:2016 | Microcircuits |
| IEC 61967-1:2002 | Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 1: General conditions and definitions |
| SAE AS6081 | Fraudulent/Counterfeit Electronic Parts: Avoidance, Detection, Mitigation, and Disposition - Distributors |
| IEC 61340-5-1:2016 | Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements |
| MIL-PRF-19500 Revision P:2010 | Semiconductor Devices, General Specification for |
| IEC TR 61340-5-2:2007 | Electrostatics - Part 5-2: Protection of electronic devices from electrostatic phenomena - User guide |
| IEC TS 62668-1:2016 | Process management for avionics - Counterfeit prevention - Part 1: Avoiding the use of counterfeit, fraudulent and recycled electronic components |
| SAE J1752/3_201106 | Measurement of Radiated Emissions from Integrated Circuits—TEM/Wideband TEM (GTEM) Cell Method; TEM Cell (150 kHz to 1 GHz), Wideband TEM Cell (150 kHz to 8 GHz) |
| IEC TR 62240-1:2013 | Process management for avionics - Electronic components capability in operation - Part 1: Temperature uprating |
| GEIA HB 0005-3 : 2008 | REWORK/REPAIR HANDBOOK TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES IN AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS |
| IEC TS 62647-3:2014 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 3: Performance testing for systems containing lead-free solder and finishes |
| IEC 62396-4:2013 | Process management for avionics - Atmospheric radiation effects - Part 4: Design of high voltage aircraft electronics managing potential single event effects |
| GEIA HB 0005-1 : 2006 | PROGRAM MANAGEMENT/SYSTEMS ENGINEERING GUIDELINES FOR MANAGING THE TRANSITION TO LEAD-FREE ELECTRONICS |
| IEC TR 62396-7:2017 | Process management for avionics - Atmospheric radiation effects - Part 7: Management of single event effects (SEE) analysis process in avionics design |
| ISO 9004:2009 | Managing for the sustained success of an organization — A quality management approach |
| MIL-HDBK-263 Revision B:1994 | Electrostatic Discharge Control Handbook for Protection of Electrical and Electronic Parts, Assemblies and Equipment (Excluding Electrically Initiated Explosive Devices) (Metric) (S/S by ESD TR20.20) |
| IEC TS 62564-1:2016 | Process management for avionics - Aerospace qualified electronic components (AQEC) - Part 1: Integrated circuits and discrete semiconductors |
| IECQ 03-4:2014 | IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ SYSTEM) - RULES OF PRODECURE - PART 4: IECQ AVIONICS SCHEME - AVIONICS PARTS AND ASSEMBLY MANAGEMENT |
| GEIA STD 0016 : 2012 | PREPARING A DMSMS MANAGEMENT PLAN |
| IEC 62396-5:2014 | Process management for avionics - Atmospheric radiation effects - Part 5: Assessment of thermal neutron fluxes and single event effects in avionics systems |
| IEC 62396-3:2013 | Process management for avionics - Atmospheric radiation effects - Part 3: System design optimization to accommodate the single event effects (SEE) of atmospheric radiation |
| ISO 9001:2015 | Quality management systems — Requirements |
| EIA STD 4899 : 2017-05 | REQUIREMENTS FOR AN ELECTRONIC COMPONENTS MANAGEMENT PLAN |
| ISO 9000:2015 | Quality management systems — Fundamentals and vocabulary |
| MIL-PRF-38535 Revision K:2013 | Integrated Circuits (Microcircuits) Manufacturing, General Specification for |
| SAE AS6496 | Fraudulent/Counterfeit Electronic Parts: Avoidance, Detection, Mitigation, and Disposition - Authorized/Franchised Distribution |
| AIAA R 100 : A 2001 | RECOMMENDED PRACTICE FOR PARTS MANAGEMENT |
| MIL-STD-3018 Base Document:2007 | Parts Management (S/S by MIL-STD-11991) |
| GEIA STD 0008 : 2011 | DERATING OF ELECTRONIC COMPONENTS |
| GEIA STD 0002-1 : 2005 | AEROSPACE QUALIFIED ELECTRONIC COMPONENT (AQEC) REQUIREMENTS, VOLUME 1 - INTEGRATED CIRCUITS AND SEMICONDUCTORS |
| IPC J STD 020D-1:2008 | MOISTURE/REFLOW SENSITIVITY CLASSIFICATION FOR NONHERMETIC SURFACE MOUNT DEVICES |
| IEC TS 62647-2:2012 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2: Mitigation of deleterious effects of tin |
| EN 190000:1995 | Generic Specification: Monolithic integrated circuits |
| SAE AS9000A | Aerospace Basic Quality System Standard |
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