BS 3934-5:1997
Current
The latest, up-to-date edition.
Mechanical standardization of semiconductor devices Recommendations applying to tape automated bonding (TAB) of integrated circuits
Hardcopy , PDF
English
15-09-1997
INTRODUCTION
1 Scope
2 Terms and definitions
3 Description of tape automated bonding (TAB)
4 Dimensional requirements
4.1 Film format
4.2 Alignment holes
4.3 Body size
4.4 Test pad patterns
4.5 Outer lead patterns
4.6 Maximum lead count
5 Variation codes
6 Requirements for inner and outer lead bonding (LIB
and OLB)
Figures
Tables
Notes to figures and tables
Annexes
A Summary of recommended TAB package configurations
(super format)
B Summary of recommended TAB package configurations
(wide format)
C Outer lead numbering
D Test pad numbering
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