• There are no items in your cart
We noticed you’re not on the correct regional site. Switch to our AMERICAS site for the best experience.
Dismiss alert

BS EN 60068-2-69:2017+A1:2019

Current

Current

The latest, up-to-date edition.

Environmental testing Tests. Test Te/Tc. Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

11-09-2019

This part of IEC 60068 outlines test Te/Tc, the solder bath wetting balance method and the solder globule wetting balance method to determine, quantitatively, the solderability of the terminations.

This part of IEC60068 outlines test Te/Tc, the solder bath wetting balance method and the solder globule wetting balance method to determine, quantitatively, the solderability of the terminations. Data obtained by these methods are not intended to be used as absolute quantitative data for pass–fail purposes.

The procedures describe the solder bath wetting balance method and the solder globule wetting balance method. They are applicable to components and printed boards with metallic terminations and metallized solder pads.

This document provides the measurement procedures for solder alloys both with and without lead (Pb).

Committee
EPL/501
DocumentType
Standard
ISBN
9780539000160
Pages
60
ProductNote
THIS STANDARD ALSO REFERS TO EIA/IPC/JEDEC J-STD-002D,IPC J-STD-003C
PublisherName
British Standards Institution
Status
Current
Supersedes

Standards Relationship
EN 60068-2-69:2017/A1:2019 Identical
IEC 60068-2-69:2017+AMD1:2019 CSV Identical

View more information
£276.00
Excluding VAT

Access your standards online with a subscription

Features

  • Simple online access to standards, technical information and regulations.

  • Critical updates of standards and customisable alerts and notifications.

  • Multi-user online standards collection: secure, flexible and cost effective.