BS EN 60191-6-20:2010
Current
The latest, up-to-date edition.
Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline J-lead packages (SOJ)
Hardcopy , PDF
English
31-12-2010
Foreword
1 Scope
2 Normative references
3 Terms and definitions
4 Measuring methods
Annex ZA (normative) - Normative references to international
publications with their corresponding European
publications
Defines methods to measure package dimensions of small outline J-lead-packages (SOJ), package outline form E in accordance with IEC 60191-4.
| Committee |
EPL/47
|
| DevelopmentNote |
Supersedes 08/30190026 DC. (12/2010)
|
| DocumentType |
Standard
|
| Pages |
16
|
| PublisherName |
British Standards Institution
|
| Status |
Current
|
| Supersedes |
This part of IEC 60191 specifies methods to measure package dimensions of small outline Jlead-packages (SOJ), package outline form E in accordance with IEC 60191-4.
| Standards | Relationship |
| EN 60191-6-20:2010 | Identical |
| IEC 60191-6-20:2010 | Identical |
| I.S. EN 60191-6-20:2010 | Equivalent |
| IEC 61937-14:2017 | Identical |
| EN 61988-4:2007 | Identical |
| UNE-EN 60191-6-20:2010 | Equivalent |
| IEC 60191-6:2009 | Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages |
| IEC 60191-4:2013 | Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages |
| EN 60191-6:2009 | Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages |
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