Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages Design guide for fine-pitchball grid array (FBGA)

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

15-11-2001

Publisher

British Standards Institution

1 Scope
2 Normative references
3 Definitions
Annex ZA (normative) Normative references to international
publications with their corresponding European
publications

Provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch ball grid array (hereinafter called FBGA), whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is square. The aim of this design guide is to standardize outlines and secure interchangeability of FBGA packages.

Provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch ball grid array the terminal pitch of which is less than or equal to 0,80 mm.

Committee	EPL/47
DevelopmentNote	Also numbered as IEC 60191-6-5. (12/2001)
DocumentType	Standard
Pages	14
PublisherName	British Standards Institution
Status	Current

Standards	Relationship
UNE-EN 60191-6-5:2002	Identical
EN 60191-6-5:2001	Identical
I.S. EN 60191-6-5:2002	Identical
DIN EN 60191-6-5:2002-05	Identical
NF EN 60191-6-5 : 2002	Identical

IEC 60191-6:2009

Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages

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BS EN 60191-6-5:2001

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages Design guide for fine-pitchball grid array (FBGA)

Table of Contents

Abstract

Scope

General Product Information

International Equivalents

Standards Referencing This Book

Category

Subcategory