• Shopping Cart
    There are no items in your cart
We noticed you’re not on the correct regional site. Switch to our AMERICAS site for the best experience.
Dismiss alert
Celebrate World Standards Day. Save 10% with code WSD2026 until 31 Oct. Save now

BS EN 60664-3:2017

Current

Current

The latest, up-to-date edition.

Insulation coordination for equipment within low-voltage systems Use of coating, potting or moulding for protection against pollution

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

18-10-2017

£232.00
Excluding VAT
Summarise this standard

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 Design requirements
5 Tests
Annex A (normative) - Test sequences
Annex B (normative) - Decisions to be taken by the technical
        committees
Annex C (normative) - Printed wiring board for testing coatings
Bibliography
Annex ZA (normative) - Normative references to
         international publications with their
         corresponding European publications

Pertains to assemblies protected against pollution by the use of coating, potting or moulding, thus allowing a reduction of clearance and creepage distances as described in IEC 60664-1.

Committee
GEL/109
DevelopmentNote
Supersedes 00/242659 DC (06/2003) Supersedes 09/30201707 DC. (08/2010) Supersedes 16/30336979 DC. (10/2017)
DocumentType
Standard
Pages
32
PublisherName
British Standards Institution
Status
Current
Supersedes

This part of IEC60664 applies to assemblies protected against pollution by the use of coating, potting or moulding, thus allowing a reduction of clearance and creepage distances as described in IEC60664‑1 . This document describes the requirements and test procedures for two methods of protection: type1 protection improves the microenvironment of the parts under the protection; type2 protection is considered to be similar to solid insulation. This document also applies to all kinds of protected printed boards, including the surface of inner layers of multi-layer boards, substrates and similarly protected assemblies. In the case of multi-layer printed boards, the distances through an inner layer are covered by the requirements for solid insulation in IEC60664‑1 . NOTE Examples of substrates are hybrid integrated circuits and thick-film technology. This document refers only to permanent protection. It does not cover assemblies that are subjected to mechanical adjustment or repair. The principles of this standard are applicable to functional, basic, supplementary and reinforced insulation.

Standards Relationship
EN 60512-16-21:2012 Identical
EN 60664-3:2017 Identical
I.S. EN 60664-3:2017 Identical
DIN EN 60664-3:2017-11 Identical
NF EN 60664-3 : 2017 Identical
IEC 60664-3:2016 Identical
NBN EN 60664-3 : 2003 AMD 1 2010 Identical
UNE-EN 60664-3:2004 Identical

£232.00
Excluding VAT