BS EN 61188-5-8:2008

INTRODUCTION
1 Scope
2 Normative references
3 General information
  3.1 General component description
  3.2 Marking
  3.3 Carrier packaging format
  3.4 Process considerations
4 BGA (square)
  4.1 Field of application
  4.2 Component descriptions
      4.2.1 Basic construction
      4.2.2 Termination materials
      4.2.3 Marking
      4.2.4 Carrier package format
      4.2.5 Process considerations
  4.3 Component dimensions (square)
      4.3.1 PBGA 1,5 mm pitch component
            dimensions (square)
      4.3.2 PBGA 1,27 mm pitch component
            dimensions (square)
      4.3.3 PBGA 1,00 mm pitch component
            dimensions (square)
  4.4 Solder joint fillet design
      4.4.1 Solder joint fillet design - Non-collapsing,
            collapsing (level 3)
  4.5 Land pattern dimensions
      4.5.1 PBGA 1,5 mm pitch land pattern
            dimensions (square)
      4.5.2 PBGA 1,27 mm pitch land pattern
            dimensions (square)
      4.5.3 PBGA 1,00 mm pitch land pattern
            dimensions (square)
5 FBGA (square)
6 BGA (rectangular)
  6.1 Field of application
  6.2 Component descriptions
      6.2.1 Basic construction
      6.2.2 Termination materials
      6.2.3 Marking
      6.2.4 Carrier package format
      6.2.5 Process considerations
  6.3 Component dimensions (rectangular)
  6.4 Solder joint fillet design
      6.4.1 Solder joint fillet design - Collapsing
            (level 3)
      6.4.2 Land approximation
      6.4.3 Total variation
  6.5 Land pattern dimensions
7 FBGA (rectangular)
8 CGA
9 LGA
Annex ZA (normative) - Normative references to international
                       publications with their corresponding
                       European publications
Bibliography