BS EN 61191-4:2017
Current
The latest, up-to-date edition.
Printed board assemblies Sectional specification. Requirements for terminal soldered assemblies
Hardcopy , PDF
English
20-11-2017
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 General requirements
5 General terminal and part mounting requirements
6 Acceptance requirements
7 Rework of unsatisfactory soldered connections
Bibliography
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications
Gives requirements for terminal soldered assemblies. Also Applies to those assemblies that are entirely terminal/wire interconnecting structures or to the terminal/wire portions of those assemblies that include other related technologies (i.e. surface mounting, through-hole mounting, chip mounting).
| Committee |
EPL/501
|
| DevelopmentNote |
Supersedes 93/206813 DC (11/2005) Supersedes 15/30329572 DC. (11/2017)
|
| DocumentType |
Standard
|
| Pages |
26
|
| PublisherName |
British Standards Institution
|
| Status |
Current
|
| Supersedes |
IEC61191-4:2017(E) prescribes requirements for terminal soldered assemblies. The requirements pertain to those assemblies that are entirely terminal/wire interconnecting structures or to the terminal/wire portions of those assemblies that include other related technologies (i.e. surface mounting, through-hole mounting, chip mounting).
This edition includes the following significant technical changes with respect to the previous edition:
The requirements have been updated to be compliant with the acceptance criteria in IPC?A-610F.
| Standards | Relationship |
| NBN EN 61191-4 : 1999 | Identical |
| IEC 61191-4:2017 | Identical |
| I.S. EN 61191-4:1999 | Identical |
| DIN EN 61191-4:2016-01 (Draft) | Identical |
| NF EN 61191-4 : 1999 | Identical |
| EN 61191-4:2017 | Identical |
| I.S. EN 61191-4:2017 | Equivalent |
| UNE-EN 61191-4:2017 | Equivalent |
| IEC 61193-3:2013 | Quality assessment systems - Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing |
| IEC 61193-1:2001 | Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies |
| IEC 61188-5-3:2007 | Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides |
| IEC 61188-5-2:2003 | Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components |
| IEC 60068-2-58:2015+AMD1:2017 CSV | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) |
| IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| IPC J STD 001 : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IEC 61190-1-2:2014 | Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly |
| IEC 62326-1:2002 | Printed boards - Part 1: Generic specification |
| IPC J STD 006 : C | REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS |
| IPC J STD 004 : B | REQUIREMENTS FOR SOLDERING FLUXES |
| IPC TM 650 : 0 | TEST METHODS MANUAL |
| IEC 62326-4:1996 | Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification |
| IPC A 610 : F | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC J STD 005 : A | REQUIREMENTS FOR SOLDERING PASTES |
| IPC J STD 002 : D | SOLDERABILITY TESTS FOR COMPONENT LEADS, TERMINATIONS, LUGS, TERMINALS AND WIRES |
| IEC 61188-7:2017 | Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction |
| IEC 61191-1:2013 | Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies |
| IEC 61188-5-6:2003 | Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides |
| IEC 61188-5-1:2002 | Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements |
| IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
| IEC 61188-5-5:2007 | Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides |
| ISO 9001:2015 | Quality management systems — Requirements |
| IEC 62326-4-1:1996 | Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1: Capability detail specification - Performance levels A, B and C |
| IPC OI 645 : 0 | STANDARD FOR VISUAL OPTICAL INSPECTION AIDS |
| EN 61191-1:2013 | Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies |
| IEC 61188-5-4:2007 | Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides |
| IPC J STD 003 : C | SOLDERABILITY TESTS FOR PRINTED BOARDS |
| IPC SM 817 : A | GENERAL REQUIREMENTS FOR DIELECTRIC SURFACE MOUNTING ADHESIVES |
| IPC J STD 020D-1:2008 | MOISTURE/REFLOW SENSITIVITY CLASSIFICATION FOR NONHERMETIC SURFACE MOUNT DEVICES |
| IEC 61189-2:2006 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures |
| IPC 9191 : 0 | GENERAL GUIDELINES FOR IMPLEMENTATION OF STATISTICAL PROCESS CONTROL (SPC) |
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