BS EN 61760-1:2006
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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Surface mounting technology Standard method for the specification of surface mounting components (SMDs)
Hardcopy , PDF
English
29-09-2006
02-10-2020
INTRODUCTION
1 Scope and object
1.1 Scope
1.2 Object
2 Normative references
3 Terms and definitions
4 Requirements for component design and component
specifications
4.1 General requirement
4.2 Packaging
4.3 Labelling of product packaging
4.4 Component marking
4.5 Storage and transportation
4.6 Component outline and design
4.7 Mechanical stress
4.8 Component reliability assurance
4.9 Additional requirements for compatibility with
lead-free soldering
5 Specification of assembly process conditions
5.1 General
5.2 Securing the component on the substrate prior
to soldering
5.3 Mounting methods
5.4 Cleaning (where applicable)
5.5 Removal and/or replacement of SMDs
6 Typical process conditions
6.1 Soldering processes, temperature/time profiles
6.2 Typical cleaning conditions for assemblies
7 Requirements for components and component specifications
related to suitability with various mounting processes
7.1 General
7.2 Wettability
7.3 Resistance to dissolution of metallization
7.4 Resistance to soldering heat
7.5 Resistance to cleaning solvent
7.6 Soldering profiles
7.7 Bonding strength test for the component glue interface
test
Bibliography
Annex ZA (normative) Normative references to international
publications with their corresponding
European publications
Provides a reference set of process conditions and related test conditions to be used when compiling component specifications of electronic components that are intended for usage in surface mount technology.
| Committee |
EPL/501
|
| DocumentType |
Standard
|
| Pages |
34
|
| PublisherName |
British Standards Institution
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
IEC 61760-1:2006-04(en-fr) gives a reference set of process conditions and related test conditions to be used when compiling component specifications of electronic components that are intended for usage in surface mount technology. The main changes with regard to the previous edition concern:
- requirements related to lead-free soldering;
- extension of the scope to include also components mounted by gluing;
- direct reference to IEC 60068-2-58 for requirements on solderability and resistance to soldering heat;
- classification into categories based on the component\'s ability to withstand resistance to soldering heat has been deleted.
| Standards | Relationship |
| EN 61760-1:2006 | Identical |
| DIN EN 61760-1:2006-10 | Identical |
| NBN EN 61760-1 : 2007 | Identical |
| IEC 61760-1:2006 | Identical |
| I.S. EN 61760-1:2006 | Identical |
| NF EN 61760-1 : 2014 | Identical |
| IEC 61291-4:2008 | Identical |
| UNE-EN 61760-1:2006 | Equivalent |
A newer version of this standard is available.
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