BS EN 62047-17:2015
Current
The latest, up-to-date edition.
Semiconductor devices. Micro-electromechanical devices Bulge test method for measuring mechanical properties of thin films
Hardcopy , PDF
English
31-07-2015
FOREWORD
1 Scope
2 Normative references
3 Terms, definitions and symbols
4 Principle of bulge test
5 Test apparatus and environment
6 Specimen
7 Test procedure and analysis
8 Test report
Annex A (informative) - Determination of mechanical
properties
Annex B (informative) - Deformation measurement
techniques
Annex C (informative) - Example of test piece fabrication:
MEMS process
Bibliography
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications
Defines the method for performing bulge tests on the free-standing film that is bulged within a window.
| Committee |
EPL/47
|
| DevelopmentNote |
Supersedes 11/30231583 DC. (07/2015)
|
| DocumentType |
Standard
|
| Pages |
34
|
| PublisherName |
British Standards Institution
|
| Status |
Current
|
| Supersedes |
IEC 62047-17:2015 specifies the method for performing bulge tests on the free-standing film that is bulged within a window. The specimen is fabricated with micro/nano structural film materials, including metal, ceramic and polymer films, for MEMS, micromachines and others. The thickness of the film is in the range of 0,1 ? to 10 ?, and the width of the rectangular and square membrane window and the diameter of the circular membrane range from 0,5 mm to 4 mm. The tests are carried out at ambient temperature, by applying a uniformly-distributed pressure to the testing film specimen with bulging window. Elastic modulus and residual stress for the film materials can be determined with this method.
| Standards | Relationship |
| IEC 62047-17:2015 | Identical |
| EN 62047-17:2015 | Identical |
| DIN EN 62047-17:2015-12 | Equivalent |
| I.S. EN 62047-17:2015 | Equivalent |
| UNE-EN 62047-17:2015 | Equivalent |
| IEC 62047-2:2006 | Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials |
| EN 62047-2:2006 | Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials |
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