BS EN IEC 61188-6-1:2021
Current
The latest, up-to-date edition.
Circuit boards and circuit board assemblies. Design and use Land pattern design. Generic requirements for land pattern on circuit boards
Hardcopy , PDF
English
07-04-2021
| Committee |
EPL/501
|
| DocumentType |
Standard
|
| Pages |
36
|
| PublisherName |
British Standards Institution
|
| Status |
Current
|
| Supersedes |
IEC 61188-6-1:2021 specifies the requirements for soldering surfaces on circuit boards. This includes lands and land pattern for surface mounted components and also solderable hole configurations for through-hole mounted components. These requirements are based on the solder joint requirements of the IEC 61191-1, IEC 61191-2, IEC 61191-3 and IEC 61191-4.
| Standards | Relationship |
| IEC 61188-6-1:2021 | Equivalent |
| I.S. EN IEC 61188-6-1:2021 | Equivalent |
| EN IEC 61188-6-1:2021 | Equivalent |
| UNE-EN IEC 61188-6-1:2021 | Equivalent |
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