BS IEC 63055:2016
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
Format for LSI-Package-Board interoperable design
Hardcopy , PDF
English
30-11-2016
08-11-2023
1 Overview
2 Normative references
3 Definitions, acronyms, and abbreviations
4 Concept of the LPB Format
5 Language basics
6 Common elements in M-Format, C-Format,
and R-Format
7 M-Format
8 C-Format
9 R-Format
10 N-Format
11 G-Format
Annex A (informative) - Bibliography
Annex B (informative) - Examples of utilization
Annex C (informative) - XML Encryption
Annex D (informative) - MD5 checksum
Annex E (informative) - Chip-Package Interface Protocol
Annex F (informative) - IEEE list of participants
Specifies a common interoperable format that will be used for the design of: a) large-scale integration (LSI), b) packages for such LSI, and c) printed circuit boards on which the packaged LSI are interconnected.
| Committee |
EPL/501
|
| DocumentType |
Standard
|
| Pages |
208
|
| PublisherName |
British Standards Institution
|
| Status |
Superseded
|
| SupersededBy |
This standard defines a common interoperable format that will be used for the design of a) large-scale integration (LSI), b) packages for such LSI, and c) printed circuit boards on which the packaged LSI are interconnected. Collectively, such designs are referred to as” LSI-Package-Board” (LPB) designs. The format provides a common way to specify information/data about the project management, netlists, components, design rules, and geometries used in LPB designs.
| Standards | Relationship |
| IEC 63055:2016 | Identical |
| IEEE 1364-2005 | IEEE Standard for Verilog Hardware Description Language |
| IEC 62433-2:2017 | EMC IC modelling - Part 2: Models of integrated circuits for EMI behavioural simulation - Conducted emissions modelling (ICEM-CE) |
| IEC 62433-4:2016 | EMC IC modelling - Part 4: Models of integrated circuits for RF immunity behavioural simulation - Conducted immunity modelling (ICIM-CI) |
| IEEE 1076-2008 REDLINE | IEEE Standard VHDL Language Reference Manual |
| IEC 62433-3:2017 | EMC IC modelling - Part 3: Models of integrated circuits for EMI behavioural simulation - Radiated emissions modelling (ICEM-RE) |
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