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BS IEC 63055:2016

BS IEC 63055:2016

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

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superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

Format for LSI-Package-Board interoperable design

Available format(s)

Hardcopy , PDF

Superseded date

08-11-2023

Language(s)

English

Published date

30-11-2016

Publisher

British Standards Institution

1 Overview
2 Normative references
3 Definitions, acronyms, and abbreviations
4 Concept of the LPB Format
5 Language basics
6 Common elements in M-Format, C-Format,
   and R-Format
7 M-Format
8 C-Format
9 R-Format
10 N-Format
11 G-Format
Annex A (informative) - Bibliography
Annex B (informative) - Examples of utilization
Annex C (informative) - XML Encryption
Annex D (informative) - MD5 checksum
Annex E (informative) - Chip-Package Interface Protocol
Annex F (informative) - IEEE list of participants

Specifies a common interoperable format that will be used for the design of: a) large-scale integration (LSI), b) packages for such LSI, and c) printed circuit boards on which the packaged LSI are interconnected.

This standard defines a common interoperable format that will be used for the design of a) large-scale integration (LSI), b) packages for such LSI, and c) printed circuit boards on which the packaged LSI are interconnected. Collectively, such designs are referred to as” LSI-Package-Board” (LPB) designs. The format provides a common way to specify information/data about the project management, netlists, components, design rules, and geometries used in LPB designs.

Committee
EPL/501
DocumentType
Standard
Pages
208
PublisherName
British Standards Institution
Status
Superseded
SupersededBy

Standards Relationship
IEC 63055:2016 Identical

IEEE 1364-2005 IEEE Standard for Verilog Hardware Description Language
IEC 62433-2:2017 EMC IC modelling - Part 2: Models of integrated circuits for EMI behavioural simulation - Conducted emissions modelling (ICEM-CE)
IEC 62433-4:2016 EMC IC modelling - Part 4: Models of integrated circuits for RF immunity behavioural simulation - Conducted immunity modelling (ICIM-CI)
IEEE 1076-2008 REDLINE IEEE Standard VHDL Language Reference Manual
IEC 62433-3:2017 EMC IC modelling - Part 3: Models of integrated circuits for EMI behavioural simulation - Radiated emissions modelling (ICEM-RE)

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Hardcopy - English
PDF - English
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