CEI CLC/TR 62258-3 : 2007
Current
The latest, up-to-date edition.
SEMICONDUCTOR DIE PRODUCTS - PART 3: RECOMMENDATIONS FOR GOOD PRACTICE IN HANDLING, PACKING AND STORAGE
Hardcopy , PDF
English
01-01-2007
FOREWORD
INTRODUCTION
1 Scope and object
2 Normative references
3 Terms and definitions
4 Handling - Good practice
5 Process handling issues
6 Die and wafer transport and storage media
7 Storage good practice
8 Traceability good practice
9 Guidelines for long-term storage (die banking) of bare
die and wafers
10 Good practice for automated handling during assembly
Annex A (informative) - Planning checklist
Annex B (informative) - Material specifications
Bibliography
Annex ZA (normative) - Normative references to international
publications with their corresponding European
publications
Pertains to facilitate the production, supply and use of semiconductor die products, including: - wafers, - singulated bare die, - die and wafers with attached connection structures, and - minimally or partially encapsulated die and wafers.
| Committee |
CT 309
|
| DevelopmentNote |
Classificazione CEI 47-54. (04/2007)
|
| DocumentType |
Standard
|
| Pages |
52
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Current
|
| Standards | Relationship |
| CLC/TR 62258-3:2007 | Identical |
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