CEI EN 60749-20 : 2010
Superseded
View Superseded by
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20: RESISTANCE OF PLASTIC ENCAPSULATED SMDS TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT
Hardcopy , PDF
English
01-01-2010
25-01-2021
FOREWORD
1 Scope
2 Normative references
3 General description
4 Test apparatus and materials
5 Procedure
6 Information to be given
in the relevant specification
Annex A (informative) - Details
and descriptions of test
method on resistance of
plastic encapsulated SMDs
to the combined effect of
moisture and soldering heat
Defines a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs).
| Committee |
CT 309
|
| DevelopmentNote |
Classificazione CEI 47-25 (04/2004) Supersedes CEI EN 60749. (05/2008)
|
| DocumentType |
Standard
|
| Pages |
34
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
| Standards | Relationship |
| IEC 60749-20:2008 | Identical |
| EN 60749-20:2009 | Identical |
A newer version of this standard is available.
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