CEI EN 60749-22 : 2004
Current
Current
The latest, up-to-date edition.
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 22: BOND STRENGTH
Available format(s)
Hardcopy , PDF
Language(s)
English
Published date
01-01-2004
Publisher
Foreword
Introduction
1 Scope and object
2 Methods A and B
3 Method C
4 Method D
5 Methods E and F
6 Method G: Wire ball
shear test
7 Information to be given
in the relevant specification
Annex A (normative) - Guidance
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