CEI EN 60749-3:2017-10
Current
Current
The latest, up-to-date edition.
Semiconductor devices - Mechanical and climatic test methods Part 3: External visual examination
Published date
01-10-2017
Publisher
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The purpose of this part of IEC 60749 is to verify that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document.
| Committee |
CT 309
|
| DocumentType |
Standard
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| EN 60749-3:2017 | Identical |
| IEC 60749-3:2017 | Identical |
Summarise
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