CEI EN 60749-37 : 2008
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 37: BOARD LEVEL DROP TEST METHOD USING AN ACCELEROMETER
Hardcopy , PDF
English
01-01-2008
17-06-2023
FOREWORD
INTRODUCTION
1 Scope and object
2 Normative references
3 Terms and definitions
4 Test apparatus and components
5 Test procedure
6 Failure criteria and failure
analysis
7 Summary
Annex A (informative) - Preferred
board construction,
material, design and layout
Bibliography
Defines to provides a test method that is intended to evaluate and compare drop performance of surface mount electronic components for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure.
| Committee |
CT 309
|
| DevelopmentNote |
Classificazione CEI 47-63. (11/2008)
|
| DocumentType |
Standard
|
| Pages |
26
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Superseded
|
| SupersededBy |
| Standards | Relationship |
| EN 60749-37:2008 | Identical |
| IEC 60749-37:2008 | Identical |
| IEC 60749-20:2008 | Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat |
| EN 60749-10:2002 | Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock |
| EN 60749-20:2009 | Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat |
| IEC 60749-10:2002 | Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock |
| IEC 60749-40:2011 | Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge |
| IEC 60749-20-1:2009 | Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat |
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